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Learning Objectives

At the end of this simulation, you will be able to:

Learn key techniques like die bonding, wire bonding, and encapsulation, which are crucial for semiconductor device functionality and reliability.
Explore the purpose of these processes in device protection, electrical connections, and mechanical stability.
Use interactive virtual tools to simulate equipment for die bonding, wire bonding, and encapsulation.
Gain proficiency in managing assembly machines, adjusting bonding parameters, and ensuring proper alignment and placement.
Conduct virtual inspections to identify defects such as improper bonding, misalignment, and encapsulation flaws.
Receive real-time feedback on handling errors, assembly techniques, and preventing defects during packaging.

How do virtual labs work?

Enhance students' involvement in science by immersing them in interactive learning scenarios. Create simulations for experiments, provide hands-on training in laboratory techniques, and convey theoretical concepts through captivating visual experiences to improve their overall long-term learning outcomes.

Access web-based simulations that are compatible with laptops, Chromebooks, tablets, and iPads, eliminating the need for software installation.
Incorporate a teacher dashboard for automated grading and monitoring of student progress.
Utilize embedded quizzes to assist students in mastering scientific content.
Comprehensive repository of educational materials, including learning resources, lab reports, videos, theory pages, graphics, and more.

Packaging and Assembly Process Simulation

Relevant Course Packages All Course Packages →

Neural Engineering and Brain-Computer Interfaces (BCIs)

Immerse students in the design and testing of neural interfaces that connect the brain to external devices, such as prosthetic limbs and communication aids. Through advanced XR simulations, students will develop and refine brain-computer interfaces (BCIs), analyze EEG signals, and create algorithms for neural control.

Drill Press Operation and Hole Machining

Train students in the safe and efficient operation of a drill press, including drilling, reaming, and tapping operations. Through XR simulations, students will practice drilling holes to precise specifications, adjusting speeds and selecting the right drill bits for different materials. The simulation will allow hands-on experience in workpiece alignment, tool selection, and achieving accurate hole dimensions. Real-time feedback will guide students on maintaining optimal drilling performance, improving hole quality, and mastering chip removal techniques.

Circuit Simulation with SPICE Software

The Circuit Simulation with SPICE Software module provides students with hands-on experience using SPICE (Simulation Program with Integrated Circuit Emphasis) software to design, simulate, and analyze both analog and digital circuits. Through interactive virtual tools, students explore circuit behavior, performance, and optimization.

Failure Mode and Effects Analysis (FMEA) Simulation

Gain expertise in Failure Mode and Effects Analysis (FMEA) through immersive XR simulations. Learn to systematically identify, assess, and mitigate potential failure points in semiconductor manufacturing processes to enhance reliability and quality.

Metal Cutting and Preparation Simulation

The Metal Cutting and Preparation Simulation immerses users in various metal cutting techniques such as oxy-fuel, plasma cutting, and grinding, all essential for preparing metals for welding. The simulation includes interactive scenarios for cutting different metals and thicknesses, along with grinding and smoothing edges. Feedback is provided on cut precision, surface quality, and preparation to ensure optimal conditions for welding.

Opening and Closing Manholes

Explore best practices for safely and efficiently opening and closing manholes using XR technology to simulate real-world scenarios.

LMS Integration

imaginX seamlessly integrates with leading LMS (Learning Management Systems), enabling educators to track student performance and allowing students to maintain their work records. It is compatible with popular platforms such as Canvas, Blackboard, Moodle, Google Classroom, Schoology, Sakai, Brightspace/D2L, and can also be used independently of an LMS.