Learning Objectives

At the end of this simulation, you will be able to:

Learn key techniques like die bonding, wire bonding, and encapsulation, which are crucial for semiconductor device functionality and reliability.
Explore the purpose of these processes in device protection, electrical connections, and mechanical stability.
Use interactive virtual tools to simulate equipment for die bonding, wire bonding, and encapsulation.
Gain proficiency in managing assembly machines, adjusting bonding parameters, and ensuring proper alignment and placement.
Conduct virtual inspections to identify defects such as improper bonding, misalignment, and encapsulation flaws.
Receive real-time feedback on handling errors, assembly techniques, and preventing defects during packaging.

How do virtual labs work?

Enhance students' involvement in science by immersing them in interactive learning scenarios. Create simulations for experiments, provide hands-on training in laboratory techniques, and convey theoretical concepts through captivating visual experiences to improve their overall long-term learning outcomes.

Access web-based simulations that are compatible with laptops, Chromebooks, tablets, and iPads, eliminating the need for software installation.
Incorporate a teacher dashboard for automated grading and monitoring of student progress.
Utilize embedded quizzes to assist students in mastering scientific content.
Comprehensive repository of educational materials, including learning resources, lab reports, videos, theory pages, graphics, and more.

Packaging and Assembly Process Simulation

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