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Learning Objectives

At the end of this simulation, you will be able to:

Learn key techniques like die bonding, wire bonding, and encapsulation, which are crucial for semiconductor device functionality and reliability.
Explore the purpose of these processes in device protection, electrical connections, and mechanical stability.
Use interactive virtual tools to simulate equipment for die bonding, wire bonding, and encapsulation.
Gain proficiency in managing assembly machines, adjusting bonding parameters, and ensuring proper alignment and placement.
Conduct virtual inspections to identify defects such as improper bonding, misalignment, and encapsulation flaws.
Receive real-time feedback on handling errors, assembly techniques, and preventing defects during packaging.

How do virtual labs work?

Enhance students' involvement in science by immersing them in interactive learning scenarios. Create simulations for experiments, provide hands-on training in laboratory techniques, and convey theoretical concepts through captivating visual experiences to improve their overall long-term learning outcomes.

Access web-based simulations that are compatible with laptops, Chromebooks, tablets, and iPads, eliminating the need for software installation.
Incorporate a teacher dashboard for automated grading and monitoring of student progress.
Utilize embedded quizzes to assist students in mastering scientific content.
Comprehensive repository of educational materials, including learning resources, lab reports, videos, theory pages, graphics, and more.

Packaging and Assembly Process Simulation

Relevant Course Packages All Course Packages →

Molecular Biology and DNA Manipulation

The Molecular Biology and DNA Manipulation module introduces students to key concepts in molecular biology, focusing on DNA structure, replication, transcription, and translation. Through virtual labs and interactive tutorials, students explore essential laboratory techniques in genetic research and manipulation.

Machining Materials and Tool Selection

Provide hands-on training in selecting and machining various materials, including steel, aluminum, brass, and plastics. Through virtual XR simulations, students will match materials with the correct cutting tools based on hardness, toughness, and machinability. They will practice adjusting cutting parameters, like speed, feed rates, and depth of cut, ensuring optimal performance and longevity of tools in real-time machining scenarios. This immersive experience will help students understand material behavior and improve machining efficiency in both manual and CNC operations.

Smart Grid and Internet of Things (IoT) Integration

The Smart Grid and Internet of Things (IoT) Integration module trains students on integrating smart grid technology with IoT devices in electrical systems. Through interactive virtual simulations, students explore the design, communication, and management of smart grid components, focusing on scalability, security, and energy efficiency.

Electrostatic Discharge (ESD) Prevention Simulation

Learn how to prevent Electrostatic Discharge (ESD) damage through interactive XR simulations. Understand the critical measures required to protect sensitive semiconductor devices during fabrication, handling, and packaging processes.

Flight Control Systems Calibration and Adjustment

Immerse in an XR-powered environment to master the calibration and adjustment of flight control systems, including ailerons, rudders, elevators, and flaps. Gain hands-on experience in ensuring precision and smooth operation for optimal aircraft control.

Microcontroller and Embedded Systems Programming

The Microcontroller and Embedded Systems module provides virtual environments (e.g., Arduino, Raspberry Pi) where students can design, simulate, and test embedded systems. Through interactive exercises, students learn to interface sensors, actuators, and communication modules, while writing and debugging code to control devices effectively.

LMS Integration

imaginX seamlessly integrates with leading LMS (Learning Management Systems), enabling educators to track student performance and allowing students to maintain their work records. It is compatible with popular platforms such as Canvas, Blackboard, Moodle, Google Classroom, Schoology, Sakai, Brightspace/D2L, and can also be used independently of an LMS.